Reduced CO2 Footprint for Silicon Ingot Manufacturers

The ArgonØ recovers and recycles up to 95% of the purge gas from silicon vacuum furnaces (Image: Gas Recovery & Recycle Ltd)

This technology can deliver improved process stability, process cost reduction, reduced CO2 footprint, and productivity enhancement. By reducing the risk associated with frequent gas delivery it can also improve the security of supply. The system can connect multiple vacuum furnaces up to its maximum total gas flow capability of 200 nl/min. Retrofitting to installed systems is straightforward. Working with both Czochralski (CZ) and  Directional Solidification (DS) vacuum silicon furnaces, the system’s associated recovery modules connect directly to the furnace vacuum pumps exhausts, with standard industry components, and transfers the exhausted purge gas to the system at its ideal working pressure. Internally, the unit has redundant process vessels and regenerates the off-line processing vessels after pre-set periods of duty, thus enabling 24/7 operation. Typical payback (ROI) would be 18–30 months, depending on local conditions. The compounds used in the unit are also suitable for helium recovery.  www.gr2l.co.uk