Inspection System
Reliable Detection of Microcracks
Reliable µcrack-detection is most important in wafer, cell, and module production. The Antares system is a tool for automatic inline detection of cracks in wafers and cells.
Field tests have shown that, even for conventionally pretested wafers, the inspection system can reduce the breakage rate by approximately one percentage point Picture: Intego
The quality of crack detection is no longer impaired by grain boundaries or other perturbing structures often seen in electroluminescence (EL) or photoluminescence (PL) images. The system works contact-free and generates images of wafers and cells which can be used directly for automatic defect detection. Results can be presented on an operator monitor, where the user can change system parameters such as minimal defect size, supervise inspection results, and handle external signals. The results can be communicated to the manufacturer’s MES. The inspection system is available in different versions, both as inline tool (to be integrated above existing conveyor belts or for integration into stringers) and as stand-alone system capable of sorting out defective parts. It consists of a vision cabinet, including maintenance-free illumination and cameras, sensors, and light barriers, and of an industrial PC The stand-alone version including the sorting module additionally contains all automation parts. The inspection system can inspect mono- and multicrystalline wafers and cells of 156 × 156mm, with a thickness range between 120 and 300 µm. It has a cycle time of down to one second per cell (less if necessary for wafers), allowing its use in standard automated production lines. The vision system is delivered with a CE certificate.
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